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SEMIAN

RS SPUTTER SERIES

SPUTTER

THIN FLIM SPUTTER

CARBON COATER

Rotary Sputter and Coater

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From Basic to High-End. Rotary Sputter Series.

Setting a new standard for low-vacuum coaters approaching the performance of high-end sputtering systems. From basic EM sample preparation to high-quality thin film deposition, discover a scalable solution that evolves with your research needs.

RS SPUTTER
FOR SEM
The Essential Partner
for SEM Imaging

The SEMIAN Rotary Sputter is the standard model optimized for Scanning Electron Microscope (SEM) sample preparation. Featuring an intuitive touch interface for easy operation and a compact design to maximize laboratory space efficiency, it ensures optimal imaging quality for routine analysis through rapid vacuum control and stable plasma technology.

Rapid Vacuum Control: Reaches a base pressure of 5.0x10⁻² Torr quickly, significantly reducing process time and maximizing work efficiency.

Smart Touch Control: An intuitive touch panel allows for easy setup of Time and Thickness (FTM) modes and provides real-time monitoring of process status.

Variable WD Stage: Z-axis height adjustment optimizes the Working Distance (WD) between the sample and target, improving coating uniformity and minimizing thermal effects.

Low-Temperature Magnetron Technology: Applies heat-suppression technology to precisely coat heat-sensitive biological samples or polymer materials without damage.

RS SPUTTER SPEC

ㆍWeight: 12kg
ㆍSize: 280(W)x280(D)x350(H)mm
ㆍChamber Size: Ø 120 x 130 mm
ㆍStage: Manual X axis
ㆍWD: 40~80mm
ㆍVaccum Measeurement: Pirani Gauges
ㆍFTM: 0.1nm (unit)
ㆍWorking Pressure: 2.0x10⁻¹~1.0x10⁻² mbar
ㆍBase Pressure: 5.0x10⁻² mbar
ㆍMax Current: 30mA

RS SPUTTER
FOR
THIN FILM
A New Standard for
Thin Film Application Research

The SEMIAN Rotary Sputter TF Model is a high-performance unit optimized for high-quality thin film deposition, going beyond simple sample preparation. Equipped with an Automatic WD Control System as standard to minimize thermal damage and enhance uniformity, it enables high-quality thin film applications via pre-sputtering with an active shutter. The optional Planetary Rotation module flexibly handles demanding deposition conditions.

Automatic WD Control System: Precisely adjusts distance via touchpad to prevent thermal damage to samples and enhances convenience with an auto-return function after the process.

Stage-Integrated Precision Thickness Control: The QCM sensor moves together with the stage, detecting thickness in real-time under identical conditions to guarantee excellent process reproducibility.

Active Shutter for High-Purity Thin Films: Enables pre-sputtering to remove contaminants from the target surface beforehand, depositing only pure particles to maximize coating film purity.

Planetary Rotation for Large-Area Uniformity (Option): Performs simultaneous rotation and revolution to provide uniform coating thickness even on large areas or complex, curved sample surfaces.

RS-TF SPEC

ㆍWeight: 12kg
ㆍSize: 280(W)x280(D)x350(H)mm
ㆍChamber Size: Ø 120 x 130 mm
ㆍStage: Auto X axis, Rotation, Planetary Rotation
ㆍWD: 40~80mm
ㆍVaccum Measeurement: Pirani Gauges
ㆍFTM: 0.1nm (unit)
ㆍWorking Pressure: 2.0x10⁻¹~1.0x10⁻² mbar
ㆍBase Pressure: 5.0x10⁻³ mbar
ㆍMax Current: 150mA

RS
CARBON
COATER
Carbon Coating Optimized for
Precision Analysis

The SEMIAN Rotary Carbon Coater provides the ideal conductive coating method for preventing charging on non-conductive specimens while minimizing elemental interference and distortion of fine features during EDS, EBSD, and FIB analysis. It imparts excellent conductivity while maintaining the sample's original geometry, free from the elemental interference or surface distortion caused by metal coatings.

Precise Analysis without Elemental Interference: Utilizing carbon's low atomic number to minimize X-ray interference, offering optimal accuracy for EDS quantitative analysis and trace element detection.

Fine Feature Preservation & Structure Distortion Prevention: Forms a film with extremely fine particles, preserving nano-scale microstructures and complex surface details without distortion.

Broad Thickness Applicability: Through precise pulse and current control, it flexibly implements thicknesses ranging from ultra-thin films for EBSD analysis to thick films for FIB processing protection.

Convenient Dual Mode Support: Supports both an Auto Mode for one-touch execution of the entire process and a Manual Mode for fine-tuned control by the researcher, enhancing operational efficiency.

Thickness Mode: Automatically terminates when the set thickness is reached via a QCM sensor with 0.1 nm resolution.
Fire Count Mode: Controls coating thickness by precisely discharging for a set number of times (Interval, Fire count).